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Reflow

Reflow soldering is the most widely used method of attaching surface mount components to printed circuit boards (PCBs).  The aim of the process is to form acceptable solder joints by first pre-heating the components/PCB/solder paste and then melting the solder without causing damage by overheating.

Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or several electrical components to their contact pads, after which the entire assembly is subjected to controlled heat, which melts the solder, permanently connecting the joint. The goal of the reflow process is to melt the solder and heat the adjoining surfaces, without overheating and damaging the electrical components. 

  • Hot Air Leveling, Teledyne, Unicote Mod HSL 175
  • Air Dryer, Sullair, Mod Sar-190 D
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